Dwivedi, Neeraj and Kumar, Sushil (2012) Nanoindentation testing on copper/diamond-like carbon bi-layer films. Current Applied Physics , 12 (1). 247-253. ISSN 1567-1739 (Unpublished)

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Abstract

In the present work, the effect of indentation load on nano-mechanical properties of copper/diamond-like carbon (Cu/DLC) bi-layer films was explored. In addition, effect of Cu interlayer and influence of self bias on residual stress and various other nano-mechanical properties such as hardness (H) and elastic modulus (E) of Cu/DLC bi-layer films were also discussed. These Cu/DLC bi-layer films were deposited, using hybrid system involving radio frequency (RF)-plasma enhanced chemical vapor deposition and RF-sputtering units, under varied self biases from -125 to -225 V. The effect of penetration depth with varied load from 5 to 20 mN on H and E of these Cu/DLC bi-layer films was also analyzed.

Item Type:	Article
Additional Information:	copyright for this article belongs to M/s Elsevier
Subjects:	Materials Science Applied Physics/Condensed Matter
Divisions:	UNSPECIFIED
Depositing User:	Users 27 not found.
Date Deposited:	19 Aug 2026 11:07
Last Modified:	19 Aug 2026 11:07
URI:	https://npl.csircentral.net/id/eprint/3480

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