Liu, Y. and Wang, J. Y. and Chakraborty, B. R. (2015) Quantitative reconstruction of Ta/Si multilayer depth profiles obtained by Time-of-Flight-Secondary-Ion-Mass-Spectrometry (ToF-SIMS) using Cs+ ion sputtering. Thin Solid Films, 591. pp. 60-65. ISSN 0040-6090

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Abstract

Measured sputter depth profiles of Ta/Si multilayers consisting of 10 alternating layers of Si (10.5 nm thickness) and Ta (7.5 nm thickness) obtained by sputtering with Cs+ ions of 1 keV energy, impinging under an angle of 45 degrees, were re-evaluated by application of the Mixing-Roughness-Information depth (MRI) model for profile reconstruction. To be able to perform the latter, a decrease of the sputtering rate with sputtered depth, a strong and sputtering time dependent matrix effect of the detected Si+ ion intensity as well as preferential sputtering of Si have to be taken into account. The results disclose a similar depth resolution for the Si and Ta layers composed of atomic mixing and roughness contributions. The depth resolution increases with the sputtered depth from 4.2 to 6.8 nm at 50 and 300 s sputtering time, respectively. Except for the first and the last two layers (Nos. 19 and 20), by application of the MRI model a full reconstruction of the measured profiles of the Si and Ta multilayer structure was obtained with a mean error of about +/- 5%.

Item Type:	Article
Uncontrolled Keywords:	Sputter depth profile SIMS MRI model Profile reconstruction
Subjects:	Materials Science Applied Physics/Condensed Matter
Divisions:	UNSPECIFIED
Depositing User:	Dr. Rajpal Walke
Date Deposited:	06 Oct 2016 07:00
Last Modified:	06 Oct 2016 07:00
URI:	http://npl.csircentral.net/id/eprint/1966

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